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Surface Mount PPTC - FSMD1210 Series

※ RoHS Compliant / (Lead Free) Available

	Application:	All high-density boards
	Product Features:	Small surface mount, Solid state Faster time to trip than standard SMD devices Lower resistance than standard SMD devices
	Operation Current:	50mA~1.50A
	Maximum Voltage:	6V~60V_DC
	Temperature Range:	-40°C to 85°C
	Agency Recognition:	UL (E211981) C-UL (E211981) *TÜV(R50090556)

Part Number	Hold Current	Trip Current	Rated Voltage	Max. Current	Typical Power	Max. Time to Trip		Resistance
	Hold Current	Trip Current	Rated Voltage	Max. Current	Typical Power	Current	Time	R_MIN	R1_MAX
	I_H, A	I_T, A	V_MAX, V_DC	I_MAX, A	Pd, W	Amp	Sec	Ohms	Ohms
FSMD005-1210	0.05	0.15	60	10	0.60	0.25	3.00	3.600	50.000
FSMD005-1210-R	0.05	0.15	60	10	0.60	0.25	3.00	3.600	50.000
FSMD010-1210	0.10	0.25	60	10	0.60	0.50	1.50	1.600	15.000
FSMD010-1210-R	0.10	0.25	60	10	0.60	0.50	1.50	1.600	15.000
FSMD020-1210	0.20	0.40	30	10	0.60	8.00	0.02	0.800	5.000
FSMD020-1210-R	0.20	0.40	30	10	0.60	8.00	0.02	0.800	5.000
FSMD035-1210	0.35	0.70	16	40	0.60	8.00	0.20	0.320	1.300
FSMD035-1210-R	0.35	0.70	16	40	0.60	8.00	0.20	0.320	1.300
FSMD050-1210	0.50	1.00	16	40	0.60	8.00	0.10	0.250	0.900
FSMD050-1210-R	0.50	1.00	16	40	0.60	8.00	0.10	0.250	0.900
FSMD075-1210	0.75	1.50	8	40	0.60	8.00	0.10	0.130	0.400
FSMD075-1210-R	0.75	1.50	8	40	0.60	8.00	0.10	0.130	0.400
FSMD110-1210R	1.10	2.20	6	100	0.80	8.00	0.30	0.060	0.210
FSMD150-1210R	1.50	3.00	6	100	0.80	8.00	0.50	0.040	0.110
FSMD175-1210R	1.75	4.00	6	100	0.80	8.00	0.60	0.020	0.080
FSMD200-1210R	2.00	4.00	6	100	0.80	8.00	1.00	0.015	0.070

IH=Hold current-maximum current at which the device will not trip at 23℃still air.

IT=Trip current-minimum current at which the device will always trip at 23℃ still air.

VMAX=Maximum voltage device can withstand without damage at it rated current.(Imax)

I MAX = Maximum fault current device can withstand without damage at rated voltage (Vmax).

Pd=Typical power dissipated-type amount of power dissipated by the device when in the tripped state in 23℃ still air environment.

R MIN=Minimum device resistance at 23℃ prior to tripping.

R1 MAX =Maximum resistance of device at 23℃ measured 1 hour after tripping or reflow soldering of 260℃ for 20 seconds.

Termination pad characteristics

Termination pad materials : Pure Tin

Note: FSMD110-1210R, FSMD150-1210R, FSMD175-1210R, & FSMD200-1210R: UL & C-UL and TUV Pending

Figure 1 Figure 2

Part Number	Fig.	A		B		C		D		E
Part Number	Fig.	Min	Max	Min	Max	Min	Min	Min	Max	Min	Max
FSMD005-1210	1	3.00	3.43	2.35	2.80	0.60	1.15	0.25	0.75	-	-
FSMD005-1210-R	2	3.00	3.43	2.35	2.80	0.60	1.15	0.25	0.75	0.10	0.45
FSMD010-1210	1	3.00	3.43	2.35	2.80	0.60	1.15	0.25	0.75	-	-
FSMD010-1210-R	2	3.00	3.43	2.35	2.80	0.60	1.15	0.25	0.75	0.10	0.45
FSMD020-1210	1	3.00	3.43	2.35	2.80	0.40	0.85	0.25	0.75	-	-
FSMD020-1210-R	2	3.00	3.43	2.35	2.80	0.40	0.85	0.25	0.75	0.10	0.45
FSMD035-1210	1	3.00	3.43	2.35	2.80	0.40	0.80	0.25	0.75	-	-
FSMD035-1210-R	2	3.00	3.43	2.35	2.80	0.40	0.80	0.25	0.75	0.10	0.45
FSMD050-1210	1	3.00	3.43	2.35	2.80	0.30	0.75	0.25	0.75	-	-
FSMD050-1210-R	2	3.00	3.43	2.35	2.80	0.30	0.75	0.25	0.75	0.10	0.45
FSMD075-1210	1	3.00	3.43	2.35	2.80	0.30	0.70	0.25	0.75	-	-
FSMD110-1210R	2	3.00	3.43	2.35	2.80	0.60	1.00	0.25	0.75	0.10	0.45
FSMD150-1210R	2	3.00	3.43	2.35	2.80	0.50	0.90	0.25	0.75	0.10	0.45
FSMD175-1210R	2	3.00	3.43	2.35	2.80	0.80	1.40	0.25	0.75	0.10	0.45
FSMD200-1210R	2	3.00	3.43	2.35	2.80	0.80	1.40	0.25	0.75	0.10	0.45

A =FSMD005-1210/-R

B =FSMD010-1210/-R

C =FSMD020-1210/-R

D =FSMD035-1210/-R

E =FSMD050-1210/-R

F =FSMD075-1210/-R

G =FSMD110-1210R

H =FSMD150-1210R

I=FSMD175-1210R

J=FSMD200-1210R

P/N	Pcs /Bag	Reel/Tape	P/N	Pcs /Bag	Reel/Tape
FSMD005-1210/-R	--------	3K	FSMD075-1210/-R	--------	4K
FSMD010-1210/-R	--------	3K	FSMD110-1210R	--------	3K
FSMD020-1210/-R	--------	3K	FSMD150-1210R	--------	3K
FSMD035-1210/-R	--------	4K	FSMD175-1210R	--------	3K
FSMD050-1210/-R	--------	4K	FSMD200-1210R	--------	3K

Warning:	Operation beyond the specified maximum ratings or improper use may result in damage and possible electrical arcing and/or flame. PPTC device are intended for occasional overcurrent protection. Application for repeated overcurrent condition and/or prolonged trip are not anticipated. Avoid contact of PPTC device with chemical solvent. Prolonged contact will damage the device performance.

Pad Layouts, Solder Reflow and Rework Recommendations
The dimension in the table below provide the recommended pad layout for each FSMD1812 device

Pad dimensions (millimeters)
Device	A	B	C
Device	Nominal	Nominal	Nominal
All 1210 Series	2.00	1.00	2.80

Solder reflow

Profile Feature	Pb-Free Assembly
Average Ramp-Up Rate (Tsmax to Tp)	3 ℃/second max.
Preheat : Temperature Min (Tsmin) Temperature Max (Tsmax) Time (tsmin to tsmax)	150 ℃ 200 ℃ 60-180 seconds
Time maintained above: Temperature(T_L) Time (t_L)	217 ℃ 60-150 seconds
Peak/Classification Temperature(Tp) :	260 ℃
Time within 5℃ of actual Peak : Temperature (tp)	20-40 seconds
Ramp-Down Rate :	6 ℃/second max.
Time 25 ℃ to Peak Temperature :	8 minutes max.

Note 1: All temperatures refer to of the package,

measured on the package body surface.

Solder reflow

※ Due to “Lead Free” nature, Temperature and Dwelling time for the soldering zone is higher than those for Regular. This may cause damage to other components.

1. Recommended max past thickness > 0.25mm.

2. Devices can be cleaned using standard methods and aqueous solvent.

3. Rework use standard industry practices.

4. Storage Environment : < 30℃ / 60%RH

Caution:

1. If reflow temperatures exceed the recommended profile, devices may not meet the performance requirements.

2. Devices are not designed to be wave soldered to the bottom side of the board.

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Time

Pd, W

Sec

Fig.

FSMD005-1210

1

FSMD005-1210-R

2

Reel/Tape

Reel/Tape

FSMD005-1210/-R